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2019 The 12th International Internet of Things Exhibition
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Lamination
Lamination is a small layer of plastic on top of your card. This thin see through layer will bond with the card through heating process. The result is a strong card that is protected against water and...
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The 9th RFID Technology Show
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China International IOTE 2016 & Asia Smart Card & RFID Exhibition
Asia Smart Card and RFID Technologies Exhibition & Trade Show is a 3 day event being held from 18th August to the 20th August 2016 at the Shenzhen Convention & Exhibition Center in Shenzhen, C...
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Join in Our Trade Show Booth
China International IOTE 2016 & Asia Smart Card & RFID ExhibitionBooth NO. A7, the 2nd Exhibition HallChina International IOTE 2016 & Asia Smart Card & RFID Exhibition is the largest e...
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The 7th Asia Smartcards and RFID Technology Show
The 7th Asia Smartcards and RFID Technology Show was opened on 20th, Aug.2015 in Shenzhen International Exhibition Central
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Flip Chip
Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microele...
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